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AS3953

Datasheet - A bs o lu t e M ax i m um R at in gs

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

DC supply voltage

-0.5

5

V

Input pin voltage except LC1 and LC2

-0.5

5

V

Input pin voltage pins LC1 and LC2

-0.5

6.5

V

Peak current induced on pins

LC1 and LC2

100

mA

Input current (latchup immunity)

-100

100

mA

Norm: Jedec 78

Electrostatic Discharge

ESD

Electrostatic discharge

±2

kV

Norm: MIL 883 E method 3015

(Human Body Model)

Temperature Ranges and Storage Conditions

Storage temperature

-55

125

ºC

Package body temperature

260

ºC

Norm: IPC/JEDEC J-STD-020

The reflow peak soldering temperature

(body temperature) is specified

according IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity

Classification for Non-hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded

packages is “Matte Tin” (100% Sn)

Humidity non-condensing

585

%

MSL

Moisture Sensitivity Level for MLPD

3

Moisture Sensitivity Level for WL-CSP

1

Storage time for DOF/dies or wafers on foil

3

months

Refer to indicated date of packing

Storage temperature for DOF/dies or

wafers on foil

18

24

ºC

foil in open package

15

%

Opened package

foil in closed package

40

60

%

Unopened package