STM32F756VG datasheet(151/228 Pages) STMICROELECTRONICS

部件名	STM32F756VG

功能描述	Up to 25 communication interfaces

PDF	228 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

151 / 228 page

DocID027589 Rev 4

151/228

STM32F756xx

Electrical characteristics

196

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 43 or Figure 44,

depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be

ceramic (good quality). They should be placed them as close as possible to the chip.

Figure 43. Power supply and reference decoupling (VREF+ not connected to VDDA)

1. VREF+ input is available on all the packages except TFBGA100 whereas the VREF– is available only on

UFBGA176 and TFBGA216. When VREF- is not available, it is internally connected to VDDA and VSSA.

Figure 44. Power supply and reference decoupling (VREF+ connected to VDDA)

1. VREF+ input is available on all the packages except TFBGA100, whereas the VREF– is available only on

UFBGA176 and TFBGA216. When VREF- is not available, it is internally connected to VDDA and VSSA.

STM32F756VG 数据表(PDF) 151 Page - STMicroelectronics