RA4M3 datasheet(36/92 Pages) RENESAS

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Table 2.19

Reset timing (2 of 2)

Parameter

Symbol Min Typ Max

Unit Test conditions

Wait time after internal reset cancellation

(IWDT reset, WDT reset, software reset, SRAM parity error reset, SRAM ECC error

reset, bus master MPU error reset, TrustZone error reset, Cache parity error reset)

tRESW2 —

324 397.7 µs

—

VCC

RES

Internal reset signal

(low is valid)

tRESWP

tRESWT

VCCmin

Figure 2.12

RES pin input timing under the condition that VCC exceeds VPOR voltage threshold

RES

Internal reset signal

(low is valid)

tRESWD, tRESWS, tRESW

tRESWT

Figure 2.13

Reset input timing

2.3.4

Wakeup Timing

Table 2.20

Timing of recovery from low power modes (1 of 2)

Parameter

Symbol

Min Typ

Max

Unit Test conditions

Recovery time from

Software Standby

mode*1

Crystal resonator

connected to main clock

oscillator

System clock source is

main clock oscillator*2

tSBYMC*13 —

2.1

2.4

Figure 2.14

The division ratio of all

oscillators is 1.

System clock source is

PLL with main clock

oscillator*3

tSBYPC*13 —

2.2

2.6

External clock input to

main clock oscillator

System clock source is

main clock oscillator*4

tSBYEX*13 —

125

μs

System clock source is

PLL with main clock

oscillator*5

tSBYPE*13 —

170

255

μs

System clock source is sub-clock oscillator*6 *11

tSBYSC*13 —

0.7

0.8

System clock source is LOCO*7 *11

tSBYLO*13 —

0.7

0.9

System clock source is HOCO clock oscillator*8

tSBYHO*13 —

130

µs

System clock source is PLL with HOCO*9

tSBYPH*13 —

175

265

µs

System clock source is MOCO clock oscillator*10

tSBYMO*13 —

µs

RA4M3 Datasheet

2. Electrical Characteristics

R01DS0368EJ0120 Rev.1.20

Dec 2, 2020

Page 36 of 92

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