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RA4M3 数据表(PDF) 6 Page - Renesas Technology Corp |
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RA4M3 数据表(HTML) 6 Page - Renesas Technology Corp |
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6 / 92 page ![]() 1.2 Block Diagram Figure 1.1 shows a block diagram of the MCU superset. Some individual devices within the group have a subset of the features. Memory 1 MB code flash 8 KB data flash 128 KB SRAM DMA DMAC × 8 System Mode control Power control Register write protection MOSC/SOSC Clocks (H/M/L) OCO PLL/PLL2 Battery backup GPT32 x 4 GPT16 x 4 Timers AGT × 6 RTC CTSU Arm Cortex-M33 DTC CAC POR/LVD Reset Human machine interfaces ELC Event link SCE9 Security Analog CRC Data processing DOC Communication interfaces QSPI IIC × 2 SDHI SPI CAN × 2 SSIE USBFS SCI × 6 TSN DAC12 × 2 ADC12 × 2 1 KB Standby SRAM Bus MPU ICU WDT/IWDT MPU NVIC System timer Test and DBG interface IDAU DSP FPU Note: Not available on all parts. Figure 1.1 Block diagram 1.3 Part Numbering Figure 1.2 shows the product part number information, including memory capacity and package type. Table 1.12 shows a list of products. RA4M3 Datasheet 1. Overview R01DS0368EJ0120 Rev.1.20 Dec 2, 2020 Page 6 of 92 |
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