MCP2518FD datasheet(89/96 Pages) MICROCHIP

89 / 96 page

 2019 Microchip Technology Inc.

DS20006027A-page 89

MCP2518FD

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

4.25

1.70

MILLIMETERS

0.65 BSC

MIN

MAX

Contact Pad Length (X14)

Contact Pad Width (X14)

0.80

0.35

Microchip Technology Drawing C04-23361 Rev B

NOM

14-Lead Very Thin Plastic Dual Flat, No Lead Package (QBB) - 4.5x3 mm Body [VDFN]

Contact Pad Spacing

3.00

Contact Pad to Center Pad (X14)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

With 1.6x4.2 mm Exposed Pad and Stepped Wettable Flanks

ØV

SILK SCREEN

Contact Pad to Center Pad (X12)

0.20

Pin 1 Index Chamfer

0.30

MCP2518FD 数据表(PDF) 89 Page - Microchip Technology

MCP2518FD 数据表(HTML) 89 Page - Microchip Technology

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