P9222-R/RN Datasheet

© 2019-2022 Renesas Electronics Corporation

10

May 5, 2022

2. Specifications

2.1 Absolute Maximum Ratings

The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the device.

Functional operation of the P9222-R/RN at the absolute maximum ratings is not implied. Exposure to absolute maximum rating conditions may

affect device reliability.

Table 2.

Absolute Maximum Ratings

Parameter

Conditions

Minimum[a]

Maximum[a]

Unit

VRECT, AC1, AC2, CMA, CMB, CM1, CM2

-0.3

20

V

PDETB, PDET_RC, LDO5P0, OD[2:0]

-0.3

6

V

LDO1P8, GP[2:0], /INT, /EN

-0.3

2

V

BST1

AC1 – 0.3

AC1 + 6

V

BST2

AC2 – 0.3

AC2 + 6

V

VOUT

-0.3

13

V

PGND

-0.3

0.3

V

Maximum RMS Current from CMA, CMB, CM1, CM2

500

mA

Maximum RMS Current from AC1, AC2

2

A

[a] All voltages are referenced to ground unless otherwise noted.

2.2 Thermal Characteristics

Table 3.

Thermal Characteristics for 40-WLCSP Package

Symbol

Parameter

Value

Unit

θJA

Thermal Resistance Junction to Ambient[a][b][c][d]

47

°

C/W

θJC

Thermal Resistance Junction to Case[b][c][d]

0.202

°

C/W

θJB

Thermal Resistance Junction to Board[b][c][d]

4.36

°

C/W

TJ

Operating Junction Temperature[a][b]

-40 to +125

°

C

TA

Operating Ambient Temperature[a][b]

-40 to +85

°

C

TSTG

Storage Temperature

-55 to +150

°

C

TBUMP

Maximum Soldering Temperature (Reflow, Pb-Free)

260

°

C

[a] The maximum power dissipation is PD(MAX) = (TJ(MAX) –TA / θJA where TJ is the junction temperature and TJ(MAX) is 125°C. Exceeding the

maximum allowable power dissipation will result in excessive die temperature, and the device will enter thermal shutdown.

[b] This thermal rating was calculated on a JEDEC 51 standard four-layer board with dimensions 3” × 4.5” in still air conditions.

[c] Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, airflow, altitude, and other unlisted

variables.

[d] For the 40-WLCSP (AZG40) package, connecting the six thermal balls to the internal/external ground planes from the top to bottom sides of

the PCB is recommended for improving the overall thermal performance.