STCMB1 datasheet(9/59 Pages) STMICROELECTRONICS

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STCMB1

Pin connections and description

VCC

Supply voltage of the signal part of the IC. An electrolytic capacitor of at least 22 µF (typ. value)

must be connected between the pin and GND. Sometimes a small bypass capacitor (0.1 µF

typ.) in parallel to the ELCAP might be useful to get a clean bias voltage for the signal part of

the IC.

LVG

Low-side gate drive output. The driver is capable of a 0.3 A source and a 0.8 A sink peak

current (minimum values) to drive the lower MOSFET of the half-bridge leg. The pin is actively

pulled to GND during UVLO.

OUT

High-side gate drive floating ground. Current return for the high-side gate drive current. Layout

carefully the connection of this pin to avoid too large spikes below ground.

HVG

High-side gate drive output. The driver is capable of a 0.3 A source and a 0.8 A sink peak

current (minimum values) to drive the upper MOSFET of the half-bridge leg. A resistor internally

connected to OUT ensures that the pin is not floating during UVLO.

BOOT

High-side gate drive floating supply voltage. The bootstrap capacitor connected between this

pin and OUT is fed by an internal synchronous bootstrap diode driven in phase with the low-

side gate drive. This patented structure replaces the normally used external diode.

Table 1. Pin description (continued)

no.

Name

Function

STCMB1 数据表(PDF) 9 Page - STMicroelectronics