ADAR4002ACPZ-R7 datasheet(12/66 Pages) AD

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Data Sheet

ADAR4002

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 12 of 66

Table 5. Absolute Maximum Ratings

Parameter

Rating

V1P2 to GND

1.35 V

V1P0 to GND

1.15 V

CSB/CLKO, CLK_IN, DATA_IO, DATA_O, UPDATE,

and MODE

−0.5 V to +1.8 V

Maximum RF Input Power (RF1 or RF2)

18 dBm

Temperature

Operating Range

−40°C to +85°C

Storage Range

−65°C to +150°C

Reflow Soldering, Peak

260°C

Maximum Junction (TJ)

125°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. The PCB thermal design

requires careful attention.

θJA is the junction to the ambient with the exposed pad soldered

down, θJB is junction to board, θJC_TOP is the junction to the top of

the package, and θJC_BOTTOM is the junction to the exposed pad.

Table 6. Thermal Resistance

Package Type1

θJA

θJB

θJC_TOP

θJC_BOTTOM Unit

CP-14-6

63.9

24.9

68.5

15.4

°C/W

1 Simulated based on PCB specified in JESD-51.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001-2014

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for the ADAR4002

Table 7. ADAR4002, 14-Lead LFCSP

ESD Model

Withstand Threshold (kV)

Class

HBM

±2

CDM

±1.25

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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