STLS2F02 datasheet(42/49 Pages) STMICROELECTRONICS

部件名	STLS2F02

功能描述	Loongson 2F high performance 64-bit superscalar MIPS® microprocessor

PDF	49 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

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42 / 49 page

Thermal characteristics

STLS2F02

42/49

Thermal characteristics

7.1

Thermal resistivity

Heat spreader optimized with the following assumptions

●

Ambient temperature 40 °C

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Package assembled on PCB as per JEDEC EIA/JESD51-9

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Maximum power 7.45 W

Customer should implement power extraction from the top of the package so that package

case to ambient Rth is below 16 °C/W.

Without air flow, this can be achieved with a 40x40x15 heat spreader or 27x27x25 HS or

35x35x18 HS. This should guarantee 120 °C max junction temperature (low margin).

The preferred configuration is to use a 27x27x10 HS with 0.5m/sec. air flow. A single fan in

PC case should be enough. In such case, max Junction temp should be around 112 °C.

7.2

Reflow temperature to time curve

TheSTLS2F02 processor uses a flip chip eutectic packaging technology. It can endure

maximum reflow temperature ranging from 235 °C to 245 °C. The reflow temperature curve

and parameters are shown in Figure 11 and Table 22.

Figure 11.

Reflow temperature to time curve

STLS2F02 数据表(PDF) 42 Page - STMicroelectronics