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SH7708 数据表(PDF) 14 Page - Renesas Technology Corp |
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SH7708 数据表(HTML) 14 Page - Renesas Technology Corp |
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14 / 633 page ![]() vi 10.1.4 Register Configuration ......................................................................................... 192 10.1.5 Area Overview...................................................................................................... 193 10.1.6 PCMCIA Support ................................................................................................. 196 10.2 BSC Registers.................................................................................................................... 200 10.2.1 Bus Control Register 1 (BCR1)............................................................................ 200 10.2.2 Bus Control Register 2 (BCR2)............................................................................ 203 10.2.3 Wait State Control Register 1 (WCR1)................................................................ 204 10.2.4 Wait State Control Register 2 (WCR2)................................................................ 206 10.2.5 Individual Memory Control Register (MCR)....................................................... 209 10.2.6 DRAM Control Register (DCR) .......................................................................... 214 10.2.7 PCMCIA Control Register (PCR)........................................................................ 216 10.2.8 Synchronous DRAM Mode Register (SDMR) .................................................... 217 10.2.9 Refresh Timer Control/Status Register (RTCSR) ................................................ 218 10.2.10 Refresh Timer Counter (RTCNT) ........................................................................ 220 10.2.11 Refresh Time Constant Register (RTCOR).......................................................... 221 10.2.12 Refresh Count Register (RFCR) .......................................................................... 221 10.2.13 Cautions on Accessing Refresh Control Related Registers.................................. 222 10.3 BSC Operation................................................................................................................... 223 10.3.1 Endian/Access Size and Data Alignment ............................................................. 223 10.3.2 Description of Areas............................................................................................. 229 10.3.3 Basic Interface...................................................................................................... 232 10.3.4 DRAM Interface ................................................................................................... 239 10.3.5 Synchronous DRAM Interface ............................................................................. 255 10.3.6 Pseudo-SRAM Direct Connection ....................................................................... 271 10.3.7 Burst ROM Interface ............................................................................................ 280 10.3.8 PCMCIA Interface................................................................................................ 283 10.3.9 Waits between Access Cycles .............................................................................. 295 10.3.10 Bus Arbitration ..................................................................................................... 296 10.4 Usage Notes ....................................................................................................................... 297 10.4.1 Area 2 and 3 Bus Width Setting ........................................................................... 297 10.4.2 When Area 6 is Designated for PCMCIA, with a 16-Bit Bus Width................... 297 10.4.3 Self-Refreshing..................................................................................................... 298 10.4.4 PCMCIA Area Access.......................................................................................... 299 10.4.5 Note on DRAM Connection for Areas 2 and 3.................................................... 300 Section 11 Timer (TMU) ................................................................................................... 301 11.1 Overview............................................................................................................................ 301 11.1.1 Features ................................................................................................................ 301 11.1.2 Block Diagram...................................................................................................... 301 11.1.3 Pin Configuration ................................................................................................. 303 11.1.4 Register Configuration ......................................................................................... 303 11.2 TMU Registers .................................................................................................................. 304 11.2.1 Timer Output Control Register (TOCR) .............................................................. 304 |
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