521 datasheet(75/96 Pages) INTEL

75 / 96 page

Datasheet

Thermal Specifications and Design Considerations

Thermal Specifications and

Design Considerations

5.1

Processor Thermal Specifications

The Pentium 4 processor in the 775-land package requires a thermal solution to maintain

temperatures within operating limits as set forth in Section 5.1.1. Any attempt to operate the

processor outside these operating limits may result in permanent damage to the processor and

potentially other components within the system. As processor technology changes, thermal

management becomes increasingly crucial when building computer systems. Maintaining the

proper thermal environment is key to reliable, long-term system operation.

A complete thermal solution includes both component and system level thermal management

features. Component level thermal solutions can include active or passive heatsinks attached to the

processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of

system fans combined with ducting and venting.

For more information on designing a component level thermal solution, refer to the Intel®

Pentium® 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines.

Note:

The boxed processor will ship with a component thermal solution. Refer to Chapter 7 for details on

the boxed processor.

5.1.1

Thermal Specifications

To allow for the optimal operation and long-term reliability of Intel processor-based systems, the

system/processor thermal solution should be designed such that the processor remains within the

minimum and maximum case temperature (TC) specifications when operating at or below the

Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not

designed to provide this level of thermal capability may affect the long-term reliability of the

processor and system. For more details on thermal solution design, refer to the appropriate

processor thermal design guidelines.

The Pentium 4 processor in the 775-land package introduces a new methodology for managing

processor temperatures which is intended to support acoustic noise reduction through fan speed

control. Selection of the appropriate fan speed will be based on the temperature reported by the

processor’s thermal diode. If the diode temperature is greater than or equal to TCONTROL, the

processor case temperature must remain at or below the temperature as specified by the thermal

profile. If the diode temperature is less than TCONTROL then the case temperature is permitted to

exceed the thermal profile, but the diode temperature must remain at or below TCONTROL. Systems

that implement fan speed control must be designed to take these conditions into account. Systems

that do not alter the fan speed only need to guarantee the case temperature meets the thermal profile

specifications.

To determine a processor's case temperature specification based on the thermal profile, it is

necessary to accurately measure processor power dissipation.

521 数据表(PDF) 75 Page - Intel Corporation

521 数据表(HTML) 75 Page - Intel Corporation

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96

数据表下载