521 datasheet(4/96 Pages) INTEL

4 / 96 page

Datasheet

Contents

5.2.3

On-Demand Mode ................................................................................................. 81

5.2.4

PROCHOT# Signal................................................................................................ 82

5.2.5

THERMTRIP# Signal............................................................................................. 82

5.2.6

TCONTROL and Fan Speed Reduction.................................................................... 82

5.2.7

Thermal Diode ....................................................................................................... 83

Features ........................................................................................................................................ 85

6.1

Power-On Configuration Options........................................................................................ 85

6.2

Clock Control and Low Power States ................................................................................. 85

6.2.1

Normal State.......................................................................................................... 86

6.2.2

HALT and Enhanced HALT Powerdown States .................................................... 86

6.2.3

Stop-Grant State.................................................................................................... 87

6.2.4

Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State ...................... 88

Boxed Processor Specifications .................................................................................................... 89

7.1

Mechanical Specifications .................................................................................................. 90

7.1.1

Boxed Processor Cooling Solution Dimensions .................................................... 90

7.1.2

Boxed Processor Fan Heatsink Weight ................................................................. 91

7.1.3

Boxed Processor Retention Mechanism and Heatsink

Attach Clip Assembly............................................................................................. 91

7.2

Electrical Requirements......................................................................................................91

7.2.1

Fan Heatsink Power Supply .................................................................................. 91

7.3

Thermal Specifications .......................................................................................................93

7.3.1

Boxed Processor Cooling Requirements............................................................... 93

7.3.2

Variable Speed Fan ............................................................................................... 95

521 数据表(PDF) 4 Page - Intel Corporation

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