521 datasheet(40/96 Pages) INTEL

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Datasheet

Package Mechanical Specifications

3.5

Package Insertion Specifications

The Pentium 4 processor in the 775-land package can be inserted into and removed from a

LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the

LGA775 Socket Mechanical Design Guide.

3.6

Processor Mass Specification

The typical mass of the Pentium 4 processor in the 775-land package is 21.5 g [0.76 oz]. This mass

[weight] includes all the components that are included in the package.

3.7

Processor Materials

Table 3-3 lists some of the package components and associated materials.

3.8

Processor Markings

Figure 3-5 and Figure 3-6 show the topside markings on the processor. These diagrams aid in the

identification of the Pentium 4 processor in the 775-land package.

Table 3-3. Processor Materials

Component

Material

Integrated Heat Spreader (IHS)

Nickel Plated Copper

Substrate

Fiber Reinforced Resin

Substrate Lands

Gold Plated Copper

Figure 3-5. Processor Top-Side Marking Example

ATPO

S/N

S-Spec/CountryofAssy

INTEL

Pentium

SLxxx

[COO]

[FPO]

Frequency/L2Cache/Bus/

775_VR_CONFIG_04x

FPO

2-DMatrixMark

UniqueUnit

Identifier

ATPO Serial#

3.60GHz/1M/800/04B

521 数据表(PDF) 40 Page - Intel Corporation

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