521 datasheet(3/96 Pages) INTEL

3 / 96 page

Datasheet

Contents

Introduction .................................................................................................................................... 11

1.1

Terminology ........................................................................................................................ 12

1.1.1

Processor Packaging Terminology ........................................................................ 12

1.2

References ......................................................................................................................... 13

Electrical Specifications ................................................................................................................. 15

2.1

FSB and GTLREF...............................................................................................................15

2.2

Power and Ground Lands ................................................................................................... 15

2.3

Decoupling Guidelines ........................................................................................................15

2.3.1

VCC Decoupling .................................................................................................... 16

2.3.2

FSB GTL+ Decoupling........................................................................................... 16

2.3.3

FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 16

2.4

Voltage Identification .......................................................................................................... 17

2.4.1

Phase Lock Loop (PLL) Power and Filter .............................................................. 19

2.5

Reserved, Unused, FC and TESTHI Signals...................................................................... 20

2.6

FSB Signal Groups ............................................................................................................. 21

2.7

GTL+ Asynchronous Signals .............................................................................................. 22

2.8

Test Access Port (TAP) Connection ................................................................................... 23

2.9

FSB Frequency Select Signals (BSEL[2:0]) ....................................................................... 23

2.10

Absolute Maximum and Minimum Ratings ......................................................................... 24

2.11

Processor DC Specifications .............................................................................................. 24

2.12

VCC Overshoot Specification ............................................................................................. 33

2.12.1 Die Voltage Validation ........................................................................................... 33

2.13

GTL+ FSB Specifications.................................................................................................... 34

Package Mechanical Specifications ..............................................................................................35

3.1

Package Mechanical Drawing ............................................................................................ 35

3.2

Processor Component Keep-Out Zones............................................................................. 39

3.3

Package Loading Specifications ......................................................................................... 39

3.4

Package Handling Guidelines............................................................................................. 39

3.5

Package Insertion Specifications ........................................................................................ 40

3.6

Processor Mass Specification............................................................................................. 40

3.7

Processor Materials ............................................................................................................ 40

3.8

Processor Markings ............................................................................................................ 40

3.9

Processor Land Coordinates .............................................................................................. 41

Land Listing and Signal Descriptions ............................................................................................ 43

4.1

Processor Land Assignments ............................................................................................. 43

4.2

Alphabetical Signals Reference .......................................................................................... 66

Thermal Specifications and Design Considerations ...................................................................... 75

5.1

Processor Thermal Specifications ...................................................................................... 75

5.1.1

Thermal Specifications .......................................................................................... 75

5.1.2

Thermal Metrology ................................................................................................. 79

5.2

Processor Thermal Features .............................................................................................. 79

5.2.1

Thermal Monitor..................................................................................................... 79

5.2.2

Thermal Monitor 2.................................................................................................. 80

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