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Datasheet

Package Mechanical Specifications

3.2

Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-out zone

requirements. A thermal and mechanical solution design must not intrude into the required keep-

out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the

package substrate. See Figure 3-2 and Figure 3-3 for keep-out zones.

The location and quantity of package capacitors may change due to manufacturing efficiencies but

will remain within the component keep-in.

3.3

Package Loading Specifications

Table 3-1 provides dynamic and static load specifications for the processor package. These

mechanical maximum load limits should not be exceeded during heatsink assembly, shipping

conditions, or standard use condition. Also, any mechanical system or component testing should

not exceed the maximum limits. The processor package substrate should not be used as a

mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum

loading specification must be maintained by any thermal and mechanical solutions.

3.4

Package Handling Guidelines

Table 3-2 includes a list of guidelines on package handling in terms of recommended maximum

loading on the processor IHS relative to a fixed substrate. These package handling loads may be

experienced during heatsink removal.

Table 3-1. Processor Loading Specifications

Parameter

Minimum

Maximum

Notes

Static

80 N [18 lbf]

311 N [70 lbf]

1, 2, 3

NOTES:

These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the minimum specified

load on the processor package.

These specifications are based on limited testing for design characterization. Loading limits are for the package only and

does not include the limits of the processor socket.

Dynamic

—

756 N [170 lbf]

1, 3, 4

Dynamic loading is defined as the sum of the load on the package from a 1 lb heatsink mass accelerating through a 11 ms

trapezoidal pulse of 50 g and the maximum static load.

Table 3-2. Package Handling Guidelines

Parameter

Maximum Recommended

Notes

Shear

311 N [70 lbf]

1, 4

NOTES:

A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

Tensile

111 N [25 lbf]

2, 4

A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.

Torque

3.95 N-m [35 lbf-in]

3, 4

A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.

These guidelines are based on limited testing for design characterization.

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