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Thermal Specifications and Design Considerations

The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates

that real applications are unlikely to cause the processor to consume maximum power dissipation for

sustained periods of time. Intel recommends that complete thermal solution designs target the

Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power

consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely

event that an application exceeds the TDP recommendation for a sustained period of time. For more

details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal Monitor feature

must be enabled for the processor to remain within specification.

Table 5-1. Processor Thermal Specifications

Processor

Number

Core Frequency

(GHz)

Thermal Design

Power (W)

Minimum TC

(°C)

Maximum TC (°C)

Notes

520/521

2.80 (PRB = 0)

See Table 5-3 and Figure 5-2

1, 2

530/531

3 (PRB = 0)

See Table 5-3 and Figure 5-2

1, 2

540/541

3.20 (PRB = 0)

See Table 5-3 and Figure 5-2

1, 2

550/551

3.40 (PRB = 0)

See Table 5-3 and Figure 5-2

1, 2

550

3.40 (PRB = 1)

115

See Table 5-2 and Figure 5-1

1, 2

NOTES:

Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum pow-

er that the processor can dissipate.

This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the

maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table

for the allowed combinations of power and TC.

560/561

3.60 (PRB = 1)

115

See Table 5-2 and Figure 5-1

1, 2

570/571

3.80 (PRB = 1)

115

See Table 5-2 and Figure 5-1

1, 2

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