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Datasheet

Boxed Processor Specifications

The Pentium 4 processor on 90 nm process in the 775-land package will also be offered as a boxed

Intel processor. Boxed Intel processors are intended for system integrators who build systems from

baseboards and standard components. The boxed Pentium 4 processor in the 775-land package will

be supplied with a cooling solution. This chapter documents baseboard and system requirements

for the cooling solution that will be supplied with the boxed Pentium 4 processor in the 775-land

package. This chapter is particularly important for OEMs that manufacture baseboards for system

integrators. Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and

inches [in brackets]. Figure 7-1 shows a mechanical representation of a boxed Pentium 4 processor

in the 775-land package.

Note:

Drawings in this section reflect only the specifications on the boxed Intel processor product. These

dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system

designers’ responsibility to consider their proprietary cooling solution when designing to the

required keep-out zone on their system platforms and chassis. Refer to the Intel® Pentium® 4

Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines for further

guidance. Contact your local Intel Sales Representative for this document.

NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.

Figure 7-1. Mechanical Representation of the Boxed Processor

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