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Datasheet

Electrical Specifications

ICC_VCCA

CC FOR

PLL LANDS

—

120

ICC_VCCIOPLL

CC FOR

I/O PLL LAND

—

100

ICC_GTLREF

CC for GTLREF

—

200

µA

NOTES:

Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will be up-

dated with characterized data from silicon measurements at a later date.

Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and can not be altered.

Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings

within the VID range. Note this differs from the VID employed by the processor during a power management event (Thermal Monitor 2 or En-

hanced HALT State).

These voltages are targets only. A variable voltage source should exist on systems in the event that a different voltage is required. See Section 2.4

and Table 2-2 for more information.

The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 100 MHz bandwidth os-

cilloscope, 1.5 pF maximum probe capacitance, and 1 M

Ω minimum impedance. The maximum length of ground wire on the probe should be less

than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.

Refer to Table 2-10 and Figure 2-3 for the minimum, typical, and maximum VCC allowed for a given current. The processor should not be sub-

jected to any Vcc and Icc combination wherein VCC exceeds Vcc_max for a given current.

775_VR_CONFIG_04A and 775_VR_CONFIG_04B refer to voltage regulator configurations that are defined in the Voltage Regulator Down

(VRD) 10.1 Design Guide For Desktop LGA775 Socket.

Refer to Table 2-9 and Figure 2-2 for the minimum, typical, and maximum VCC allowed for a given current. The processor should not be subjected

to any VCC and ICC combination wherein VCC exceeds VCC_max for a given current.

These frequencies will operate in a system designed for 775_VR_CONFIG_04B processors. The power and ICC will be incrementally higher in

this configuration due to the improved loadline and resulting higher VCC.

Icc_max is specified at VCC_max.

10.

The current specified is also for AutoHALT State.

11.

Icc Stop-Grant and ICC Enhanced Auto Halt are specified at VCC_max.

12.

The maximum instantaneous current the processor will draw while the thermal control circuit is active as indicated by the assertion of PROCHOT#

is the same as the maximum Icc for the processor.

13.

VTT must be provided via a separate voltage source and not be connected to VCC. This specification is measured at the land.

14.

Baseboard bandwidth is limited to 20 MHz.

15.

These parameters are based on design characterization and are not tested.

16.

This is maximum total current drawn from VTT plane by only the processor. This specification does not include the current coming from RTT

(through the signal line). Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket to determine the total ITT

drawn by the system.

Table 2-8. Voltage and Current Specifications (Sheet 2 of 2)

Symbol

Parameter

Min

Typ

Max

Unit

Notes1

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