521 datasheet(5/96 Pages) INTEL

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Datasheet

Contents

Figures

2-1 Phase Lock Loop (PLL) Filter Requirements.............................................................................. 19

2-2 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A............................................... 28

2-3 VCC Static and Transient Tolerance for 775_VR_CONFIG_04B............................................... 30

2-4 VCC Overshoot Example Waveform .......................................................................................... 33

3-1 Processor Package Assembly Sketch ........................................................................................ 35

3-2 Processor Package Drawing 1 ................................................................................................... 36

3-3 Processor Package Drawing 2 ................................................................................................... 37

3-4 Processor Package Drawing 3 ................................................................................................... 38

3-5 Processor Top-Side Marking Example ....................................................................................... 40

3-6 Processor Top-Side Marking Example for Processors Supporting Intel® EM64T ...................... 41

3-7 Processor Land Coordinates (Top View).................................................................................... 42

4-1 Landout Diagram (Top View – Left Side).................................................................................... 44

4-2 Landout Diagram (Top View – Right Side) ................................................................................. 45

5-1 Thermal Profile for Processors with PRB = 1 ............................................................................. 77

5-2 Thermal Profile for Processors with PRB = 0 ............................................................................. 78

5-3 Case Temperature (TC) Measurement Location ........................................................................ 79

5-4 Thermal Monitor 2 Frequency and Voltage Ordering ................................................................. 81

6-1 Processor Low Power State Machine......................................................................................... 87

7-1 Mechanical Representation of the Boxed Processor.................................................................. 89

7-2 Space Requirements for the Boxed Processor (Side View) ....................................................... 90

7-3 Space Requirements for the Boxed Processor (Top View) ........................................................ 90

7-4 Space Requirements for the Boxed Processor (Overall View) ................................................... 91

7-5 Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92

7-6 Baseboard Power Header Placement Relative to Processor Socket ......................................... 93

7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View) ........................... 94

7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View) .......................... 94

7-9 Boxed Processor Fan Heatsink Set Points................................................................................. 95

521 数据表(PDF) 5 Page - Intel Corporation