ST7LITE25F2 datasheet(149/166 Pages) STMICROELECTRONICS

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Package characteristics

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14.2

Soldering information

In accordance with the RoHS European directive, all STMicroelectronics packages have

been converted to lead-free technology, named ECOPACKTM.

●

ECOPACKTM packages are qualified according to the JEDEC STD-020C compliant

soldering profile.

●

Detailed information on the STMicroelectronics ECOPACKTM transition program is

available on www.st.com/stonline/leadfree/, with specific technical Application notes

covering the main technical aspects related to lead-free conversion (AN2033, AN2034,

AN2035, AN2036).

Backward and forward compatibility

The main difference between Pb and Pb-free soldering process is the temperature range.

●

ECOPACKTM TQFP, SDIP and SO packages are fully compatible with Lead (Pb)

containing soldering process (see application note AN2034)

●

TQFP, SDIP and SO Pb-packages are compatible with Lead-free soldering process,

nevertheless it's the customer's duty to verify that the Pb packages maximum

temperature (mentioned on the Inner box label) is compatible with their Leadfree

soldering temperature.

Table 90.

Thermal characteristics

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance

(junction to ambient)

SO20

DIP20

125

°C/W

TJmax

Maximum junction temperature(1)

The maximum chip-junction temperature is based on technology characteristics.

150

°C

PDmax

Power dissipation(2)

The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.

The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT

where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the

ports used in the application.

500

Table 91.

Soldering compatibility (wave and reflow soldering process)

Package

Plating material devices

Pb solder paste

Pb-free solder paste

SDIP & PDIP

Sn (pure Tin)

Yes

Yes(1)

Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label) is

compatible with their Lead-free soldering process.

TQFP and SO

NiPdAu (Nickel-palladium-Gold)

Yes

Yes(1)

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