ADRF6850BCPZ-R7 datasheet(36/36 Pages) AD

36 / 36 page

ADRF6850

Rev. 0 | Page 36 of 36

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2

TOP VIEW

5.25

5.10 SQ

4.95

0.50

0.40

0.30

0.23

0.18

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

6.50 REF

SEATING

PLANE

0.60 MAX

0.60

MAX

COPLANARITY

0.08

0.05 MAX

0.02 NOM

0.25 MIN

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

PIN 1

INDICATOR

8.10

8.00 SQ

7.90

7.85

7.75 SQ

7.65

0.50

BSC

BOTTOM VIEW

EXPOSED

PAD

PIN 1

INDICATOR

Figure 76. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

8 mm × 8 mm Body, Very Thin Quad

(CP-56-5)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADRF6850BCPZ

−40°C to +85°C

56-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Tray

CP-56-5

ADRF6850BCPZ-R7

−40°C to +85°C

56-Lead Lead Frame Chip Scale Package [LFCSP_VQ], 7" Tape and Reel

CP-56-5

EVAL-ADRF6850EB1Z

Evaluation Board

1 Z = RoHS Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

registered trademarks are the property of their respective owners.

D09316-0-10/10(0)

ADRF6850BCPZ-R7 数据表(PDF) 36 Page - Analog Devices

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