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PCF8833U/2DA 数据表(PDF) 110 Page - NXP Semiconductors |
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PCF8833U/2DA 数据表(HTML) 110 Page - NXP Semiconductors |
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110 / 112 page  2003 Feb 14 110 Philips Semiconductors Objective specification STN RGB - 132 × 132 × 3 driver PCF8833 Bare die All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. |
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