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IOBUS0 数据表(PDF) 82 Page - Future Technology Devices International Ltd. |
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IOBUS0 数据表(HTML) 82 Page - Future Technology Devices International Ltd. |
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82 / 88 page  82 C opyright © Future T ec hnology Devic es I nternational Limited Datasheet Vinculum-II Embedded Dual USB Host Controller IC V ers ion 1 .7 Doc ument N o.: FT _000138 C learance N o.: FT DI# 1 43 12Contact Information Head Office – Glasgow, UK Future Technology Devices International Limited Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 E-mail (Sales) sales1@ftdichip.com E-mail (Support) support1@ftdichip.com E-mail (General Enquiries) admin1@ftdichip.com Branch Office – Taipei, Taiwan Future Technology Devices International Limited (Taiwan) 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan , R.O.C. Tel: +886 (0) 2 8797 1330 Fax: +886 (0) 2 8751 9737 E-mail (Sales) tw.sales1@ftdichip.com E-mail (Support) tw.support1@ftdichip.com E-mail (General Enquiries) tw.admin1@ftdichip.com Branch Office – Tigard, Oregon, USA Future Technology Devices International Limited (USA) 7130 SW Fir Loop Tigard, OR 97223-8160 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-Mail (Sales) us.sales@ftdichip.com E-Mail (Support) us.support@ftdichip.com E-Mail (General Enquiries) us.admin@ftdichip.com Branch Office – Shanghai, China Future Technology Devices International Limited (China) Room 1103, No. 666 West Huaihai Road, Shanghai, 200052 China Tel: +86 21 62351596 Fax: +86 21 62351595 E-mail (Sales) cn.sales@ftdichip.com E-mail (Support) cn.support@ftdichip.com E-mail (General Enquiries) cn.admin@ftdichip.com Web Site http://ftdichip.com Distributor and Sales Representatives Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales representative(s) in your country. N either the whole nor any part of the information c ontained in, or the product desc ribed in this manual, may be adapted or re produced in any material or electronic form without the prior written cons ent of the copyright holder. This product and its documentation are s upplied on an as-is basis and no warranty as to their s uitability for any partic ular purpose is either made or implied. Future T ec hnology Devices International Ltd will not accept any claim for damages hows oever aris ing as a res ult of us e or failure of this produc t. Y our s tatutory rights are not affec ted. T his produc t or any variant of it is not intended for use in any medical appliance, device or sys tem in whic h the failure of the produc t might reasonably be expec ted to res ult in personal injury. T his doc ument provides preliminary information that may be s ubjec t to c hange without notice. N o freedom to us e patents or other intellec tual property rights is implied by the public ation of this document. Future Tec hnology Devic es I nternational Ltd, U nit 1 , 2 Seaward P lace, C enturion Business Park, Glas gow G4 1 1 HH, U nited Kingdom. Sc otland Registered C ompany N umber: SC136640 |
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