AD6650SLASHPCB datasheet(45/45 Pages) AD

45 / 45 page

AD6650

Rev. A | Page 44 of 44

OUTLINE DIMENSIONS

*COMPLIANT WITH JEDEC STANDARDS MO-192-ABD-1 WITH

EXCEPTION TO PACKAGE HEIGHT AND THICKNESS.

DETAIL A

0.70

0.60

0.50

BALL DIAMETER

0.20

COPLANARITY

1.00

BSC

10.00

BSC SQ

8 7 63 21

5 4

*1.31

1.21

1.11

A1 CORNER

INDEX AREA

TOP VIEW

BALL A1

CORNER

DETAIL A

BOTTOM VIEW

0.50 NOM

0.30 MIN

*1.85

1.71

1.40

12.20

12.00 SQ

11.80

SEATING

PLANE

Figure 42. 121-Lead Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-121)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range1

Package Description

Package Option

AD6650ABC

−25°C to +85°C

121-Lead Chip Scale Package Ball Grid Array [CSP_BGA]

BC-121

AD6650ABCZ2

−25°C to +85°C

121-Lead Chip Scale Package Ball Grid Array [CSP_BGA]

BC-121

AD6650BBC

−25°C to +85°C

121-Lead Chip Scale Package Ball Grid Array [CSP_BGA]

BC-121

AD6650BBCZ2

−25°C to +85°C

121-Lead Chip Scale Package Ball Grid Array [CSP_BGA]

BC-121

AD6650/PCB

Evaluation Board with AD6650 and Software

1 The AD6650 is guaranteed fully functional from −40°C to +85°C. All ac minimum specifications are guaranteed from −25°C to +85°C, but degrade slightly from −25°C

to −40°C.

2 Z = Pb-free part.

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D03683-0-1/07(A)

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