EDBA164B4PR-1DATF-R datasheet(2/152 Pages) MICRON

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Figure 1: LPDDR2 Part Numbering

Micron Technology

Type

D = Packaged device

Product Family

B = Mobile LPDDR2 SDRAM

Density/Chip Select

A1 = 16Gb/4-CS (2-CS/channel)

Organization

64 = x64

Power Supply Interface

B = V

DD1 = 1.8V, V DD2 = VDDQ = 1.2V,

S4B device, HSUL

PR 1D

Speed

1D = 1066 Mb/s

Package

PR = BGA for Pop

PT = BGA for Pop

PK = BGA for Pop

Revision

Packing Media

D = Dry Pack (Tray)

R = Tape and Reel

Environment Code

F = Lead-free (RoHS-compliant)

and halogen-free

81 = 8Gb/2-CS

Special options

Blank = Non-Automotive

Operating Temperature

IT = –40°C to +85°C

AT = –40°C to +105°C

Blank = –30°C to +85°C

FBGA Part Marking Decoder

Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the

part number. Micron’s FBGA part marking decoder is available at www.micron.com/decoder.

Table 3: Package Codes and Descriptions

Package

Code

Ball

Count

# Ranks

# Chan-

nels

Size (mm)

Die per

Package

Solder Ball

Composition

216

12mm x 12mm x 0.80mm, 0.40 pitch

DDP

SAC302

216

12mm x 12mm x 0.80mm, 0.40 pitch

DDP

SAC302

216

12mm x 12mm x 1.00mm, 0.40 pitch

QDP

SAC302

220

14mm x 14mm x 0.70mm, 0.50 pitch

DDP

SAC302

Notes:

1. DDP = dual-die package, QDP = quad-die package

2. Solder ball material: SAC302 (96.8% Sn, 3% Ag, 0.2% Cu).

216-Ball and 220-Ball, Dual-Channel LPDDR2 SDRAM

Features

09005aef85eb530a

216b_220b_2ch_2e0e_embedded_lpddr2.pdf – Rev. F 08 /16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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