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EDBA164B4PR-1DATF-R 数据表(PDF) 97 Page - Micron Technology

部件名 EDBA164B4PR-1DATF-R
功能描述  216-Ball and 220-Ball, Dual-Channel LPDDR2 SDRAM Features
PDF  152 Pages
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制造商  MICRON [Micron Technology]
网页  http://www.micron.com
标志 MICRON - Micron Technology

EDBA164B4PR-1DATF-R 数据表(HTML) 97 Page - Micron Technology

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Table 55: CKE Truth Table (Continued)
Notes 1–5 apply to all parameters and conditions; L = LOW, H = HIGH, X = “Don’t Care”
Current State
CKEn-1
CKEn
CS_n
Command n
Operation n
Next State
Notes
All banks idle
H
L
H
NOP
Enter idle power-down
Idle
power-down
H
L
L
Enter self re-
fresh
Enter self refresh
Self refresh
H
L
L
DPD
Enter deep power-down
Deep
power-down
Resetting
H
L
H
NOP
Enter resetting power-down
Resetting
power-down
Other states
H
H
Refer to the command truth table
Notes:
1. Current state = the state of the device immediately prior to the clock rising edge n.
2. All states and sequences not shown are illegal or reserved unless explicitly described
elsewhere in this document.
3. CKEn = the logic state of CKE at clock rising edge n; CKEn-1 was the state of CKE at the
previous clock edge.
4. CS_n= the logic state of CS_n at the clock rising edge n.
5. Command n = the command registered at clock edge n, and operation n is a result of
command n.
6. Power-down exit time (tXP) must elapse before any command other than NOP is issued.
7. The clock must toggle at least twice prior to the tXP period.
8. Upon exiting the resetting power-down state, the device will return to the idle state if
tINIT5 has expired.
9. The DPD exit procedure must be followed as described in Deep Power Down.
10. Self refresh exit time (tXSR) must elapse before any command other than NOP is issued.
11. The clock must toggle at least twice prior to the tXSR time.
Table 56: Current State Bank n to Command to Bank n Truth Table
Notes 1–5 apply to all parameters and conditions
Current State
Command
Operation
Next State
Notes
Any
NOP
Continue previous operation
Current state
Idle
ACTIVATE
Select and activate row
Active
Refresh (per bank)
Begin to refresh
Refreshing (per bank)
6
Refresh (all banks)
Begin to refresh
Refreshing (all banks)
7
MRW
Load value to mode register
MR writing
7
MRR
Read value from mode register
Idle, MR reading
RESET
Begin device auto initialization
Resetting
7, 8
PRECHARGE
Deactivate row(s) in bank or banks
Precharging
9, 10
Row active
READ
Select column and start read burst
Reading
WRITE
Select column and start write burst
Writing
MRR
Read value from mode register
Active MR reading
PRECHARGE
Deactivate row(s) in bank or banks
Precharging
9
216-Ball and 220-Ball, Dual-Channel LPDDR2 SDRAM
Truth Tables
09005aef85eb530a
216b_220b_2ch_2e0e_embedded_lpddr2.pdf – Rev. F 08 /16 EN
97
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.



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