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SPC58ECX 数据表(PDF) 116 Page - STMicroelectronics

部件名 SPC58ECX
功能描述  SPC58 C Line - 32 bit Power Architecture automotive MCU Dual z4 cores 180 MHz, 4 MBytes Flash, HSM, ASIL-B
PDF  153 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

SPC58ECX 数据表(HTML) 116 Page - STMicroelectronics

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Package information
SPC584Cx, SPC58ECx
116/153
DS11620 Rev 8
Figure 54. eTQFP100 leadframe pad design
5.3
eTQFP144 package information
Refer to Section 5.3.1: Package mechanical drawings and data information for full
description of below figures and table notes.
Note: number, dimensions and positions of grooves are for reference only.
Table 68. eTQFP100 symbol definitions
Symbol
Definition
Notes
aaa
The tolerance that controls the position of the
terminal pattern with respect to Datum A and B. The
center of the tolerance zone for each terminal is
defined by basic dimension e as related to Datum A
and B.
For flange-molded packages, this tolerance also
applies for basic dimensions D1 and E1. For
packages tooled with intentional terminal tip
protrusions, aaa does not apply to those
protrusions.
bbb
The bilateral profile tolerance that controls the
position of the plastic body sides. The centers of the
profile zones are defined by the basic dimensions D
and E.
ccc
The unilateral tolerance located above the seating
plane where in the bottom surface of all terminals
must be located.
This tolerance is commonly know as the
“coplanarity” of the package terminals.
ddd
The tolerance that controls the position of the
terminals to each other. The centers of the profile
zones are defined by basic dimension e.
This tolerance is normally compounded with
tolerance zone defined by “b”.



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