ST25R3916 datasheet(152/157 Pages) STMICROELECTRONICS

152 / 157 page

Package information

ST25R3916/7

152/157

DS12484 Rev 4

6.2

WLCSP36 package information

WLCSP36 is a 36-ball, 3.213x3.203 mm, 0.5 mm pitch, wafer level chip scale package.

Figure 38. WLCSP36 outline

1. Drawing is not to scale.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.

4. Bump position designation per JESD 95-1, SPP-010.

Table 135. WLCSP36 mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.550

0.590

0.630

0.0217

0.0232

0.0248

0.235

0.0093

0.330

0.013

A3(2)

0.025

0.001

0.330

0.013

3.193

3.213

3.233

0.1257

0.1265

0.1273

3.183

3.203

3.223

0.1253

0.1261

0.1269

0.500

0.0197

2.500

0.0984

0.347

0.0137

B078_WLCSP36_ME_V1

Orientation reference

BOTTOM VIEW

DETAIL A

SIDE VIEW

aaa

(2X)

aaa

(2X)

TOP VIEW

Orientation reference

eee

b (36x)

ccc

ddd

Z XY

DETAIL A

Seating plane

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