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M58LR128HT 数据表(PDF) 72 Page - STMicroelectronics |
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M58LR128HT 数据表(HTML) 72 Page - STMicroelectronics |
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72 / 112 page  Package mechanical M58LR128HT, M58LR128HB 72/112 13 Package mechanical In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second-level interconnect. The category of Second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 18. VFBGA56 7.7 × 9mm - 8×7 active ball array, 0.75mm pitch, bottom view package outline 1. Drawing is not to scale. E1 E D1 D eb A2 A1 A BGA-Z38 ddd FD FE SD e BALL "A1" |
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