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M58LR128HT 数据表(PDF) 74 Page - STMicroelectronics |
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M58LR128HT 数据表(HTML) 74 Page - STMicroelectronics |
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74 / 112 page  Part numbering M58LR128HT, M58LR128HB 74/112 14 Part numbering Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available options (Speed, Package, etc.) or for further information on any aspect of this device, please contact the ST Sales Office nearest to you. Table 29. Ordering information scheme Example: M58LR128HT 85 ZB 5 E Device Type M58 Architecture L = Multi-Level, Multiple Bank, Burst Mode Operating Voltage R = VDD = 1.7V to 2.0V, VDDQ = 1.7V to 2.0V Density 128 = 128 Mbit (x16) Technology H = 90nm technology Parameter Location T = Top Boot B = Bottom Boot Speed 85 = 85ns Package ZB = VFBGA56, 7.7 x 9mm, 0.50mm pitch Temperature Range 5 = –25 to 85°C Packing Option E = ECOPACK® Package, Standard Packing F = ECOPACK® Package, Tape & Reel Packing |
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