H8SSLASH2218 datasheet(7/750 Pages) RENESAS

7 / 750 page

Rev.6.00 Jun. 03, 2008 Page vii of xlviii

REJ09B0074-0600

Main Revisions for This Edition

Item

Page

Revision (See Manual for Details)

All

⎯

H8S/2210S (HD6432210S) added

1.1 Overview

• On-chip memory

Table amended

ROM

RAM

Remarks

Part No.

Masked ROM Version

64 kbytes

32 kbytes

8 kbytes

4 kbytes

⎯

HD6432211

HD6432210

HD6432210S

H8S/2212 Group

• Compact package

Note deleted

Package

Body Size

Pin Pitch

Remarks

Code*

TQFP-100

P-LFBGA-112

LQFP-64

VQFN-64

12.0

× 2.0 mm

10.0

× 10.0 mm

10.0

× 10.0 mm

8.0

× 8.0 mm

0.4 mm

0.8 mm

0.5 mm

0.4 mm

H8S/2218 Group

H8S/2212 Group

TFP-100G, TFP-100GV

BP-112, BP-112V

FP-64E, FP-64EV

TNP-64B, TNP-64BV

Note: * A V appended to the end of the package code

indicates a lead-free version.

1.2 Internal Block

Diagram

Description amended

…The internal block diagram of the HD6432211, HD6432210

and HD6432210S is shown in figure 1.4.

Figure 1.1 Internal

Block Diagram of

HD64F2218 and

HD64F2218U

Notes amended

Notes: 1.The FWE pin is provided only in the HD64F2218 and

HD64F2218U.

2.When EMLE = 0, boundary scan is available and the

pins function as TDO, TCK, TMS,

TRST, and TDI,

respectively.

When EMLE = 1, H-UDI function is available and the

pins function as TDO, TCK, TMS,

TRST, and TDI,

respectively.

Figure 1.4 Internal

Block Diagram of

HD6432211,

HD6432210 and

HD6432210S

Title amended

1.3 Pin Arrangement 7

Description amended

…The pin arrangements of the HD6432211, HD6432210 and

HD6432210S is shown in figures 1.10 and 1.12.

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