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EM357-RTR 数据表(PDF) 19 Page - List of Unclassifed Manufacturers |
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EM357-RTR 数据表(HTML) 19 Page - List of Unclassifed Manufacturers |
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19 / 240 page ![]() EM351 / EM357 2-6 120-035X-000D Preliminary Parameter Test Conditions Min. Typ. Max. Unit Input pull-up resistor value RIPU 24 29 34 kΩ Input pull-down resistor value RIPD 24 29 34 kΩ Output voltage for logic 0 VOL (IOL = 4 mA for standard pads, 8 mA for high current pads) 0 0.18 x VDD_PADS V Output voltage for logic 1 VOH (IOH = 4 mA for standard pads, 8 mA for high current pads) 0.82 x VDD_PADS VDD_PADS V Output source current (standard current pad) IOHS 4 mA Output sink current (standard current pad) IOLS 4 mA Output source current high current pad: PA6, PA7, PB6, PB7, PC0 IOHH 8 mA Output sink current high current pad: PA6, PA7, PB6, PB7, PC0 IOLH 8 mA Total output current (for I/O Pads) IOH + IOL 40 mA 2.6 Non-RF System Electrical Characteristics Table 2-6 lists the non-RF system level characteristics for the EM35x. Table 2-6. Non-RF System Specifications Parameter Test Conditions Min. Typ. Max. Unit System wake time from deep sleep From wakeup event to first ARM® CortexTM- M3 instruction running from 6 MHz internal RC clock Includes supply ramp time and oscillator startup time 110 µs Shutdown time going into deep sleep From last ARM® CortexTM-M3 instruction to deep sleep mode 5 µs |
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