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EM357-RTR 数据表(PDF) 19 Page - List of Unclassifed Manufacturers

部件名 EM357-RTR
功能描述  High-Performance, Integrated ZigBee/802.15.4 System-on-Chip
PDF  240 Pages
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制造商  ETC2 [List of Unclassifed Manufacturers]
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标志 ETC2 - List of Unclassifed Manufacturers

EM357-RTR 数据表(HTML) 19 Page - List of Unclassifed Manufacturers

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EM351 / EM357
2-6
120-035X-000D
Preliminary
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Input pull-up resistor value
RIPU
24
29
34
Input pull-down resistor value
RIPD
24
29
34
Output voltage for logic 0
VOL
(IOL = 4 mA for standard pads, 8 mA for
high current pads)
0
0.18 x
VDD_PADS
V
Output voltage for logic 1
VOH
(IOH = 4 mA for standard pads, 8 mA for
high current pads)
0.82 x
VDD_PADS
VDD_PADS
V
Output source current (standard current
pad)
IOHS
4
mA
Output sink current (standard current pad)
IOLS
4
mA
Output source current
high current pad: PA6, PA7, PB6, PB7, PC0
IOHH
8
mA
Output sink current
high current pad: PA6, PA7, PB6, PB7, PC0
IOLH
8
mA
Total output current (for I/O Pads)
IOH + IOL
40
mA
2.6
Non-RF System Electrical Characteristics
Table 2-6 lists the non-RF system level characteristics for the EM35x.
Table 2-6. Non-RF System Specifications
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
System wake time from deep sleep
From wakeup event to first ARM® CortexTM-
M3 instruction running from 6 MHz internal
RC clock
Includes supply ramp time and oscillator
startup time
110
µs
Shutdown time going into deep sleep
From last ARM® CortexTM-M3 instruction to
deep sleep mode
5
µs



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