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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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EM357-RTR 数据表(PDF) 223 Page - List of Unclassifed Manufacturers |
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EM357-RTR 数据表(HTML) 223 Page - List of Unclassifed Manufacturers |
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223 / 240 page  EM351 / EM357 19 Mechanical Details The EM35x package is a plastic 48-pin QFN that is 7 mm x 7 mm x 0.90 mm. Figure 19-1 illustrates the package drawing. Figure 19-1. Package Drawing 19.1 QFN48 Footprint Recommendations Figure 19-2 demonstrates the IPC-7351 recommended PCB Footprint for the EM35x (QFN50P700X700X90-49N). A ground pad in the bottom center of the package forms a 49th pin. A 3 x 3 array of non-thermal vias should connect the EM35x decal center shown in Figure 19-2 to the PCB ground plane through the ground pad. In order to properly solder the EM35x to the footprint, the Paste Mask layer should have a 3 x 3 array of circular openings at 1.015 mm diameter spaced approximately 1.625 mm (center to center) apart, as shown in Figure 19-3. This will cause an evenly distributed solder flow and coplanar attachment to the PCB. The solder mask layer (illustrated in Figure 19-4) should be the same as the copper layer for the EM35x footprint. For more information on the package footprint, please refer to the appropriate EM35x Reference Design. 19-1 120-035X-000D Preliminary |
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