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ADP5050ACPZ-R7 数据表(PDF) 10 Page - Analog Devices

部件名 ADP5050ACPZ-R7
功能描述  5-Channel Integrated Power Solution with Quad Buck Regulators and 200 mA LDO Regulator
PDF  60 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP5050ACPZ-R7 数据表(HTML) 10 Page - Analog Devices

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ADP5050
Data Sheet
Rev. 0 | Page 10 of 60
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
PVIN1 to PGND
−0.3 V to +18 V
PVIN2 to PGND
−0.3 V to +18 V
PVIN3 to PGND3
−0.3 V to +18 V
PVIN4 to PGND4
−0.3 V to +18 V
PVIN5 to GND
−0.3 V to +6.5 V
SW1 to PGND
−0.3 V to +18 V
SW2 to PGND
−0.3 V to +18 V
SW3 to PGND3
−0.3 V to +18 V
SW4 to PGND4
−0.3 V to +18 V
PGND to GND
−0.3 V to +0.3 V
PGND3 to GND
−0.3 V to +0.3 V
PGND4 to GND
−0.3 V to +0.3 V
BST1 to SW1
−0.3 V to +6.5 V
BST2 to SW2
−0.3 V to +6.5 V
BST3 to SW3
−0.3 V to +6.5 V
BST4 to SW4
−0.3 V to +6.5 V
DL1 to PGND
−0.3 V to +6.5 V
DL2 to PGND
−0.3 V to +6.5 V
SS12, SS34 to GND
−0.3 V to +6.5 V
EN1, EN2, EN3, EN4, EN5 to GND
−0.3 V to +6.5 V
VREG to GND
−0.3 V to +6.5 V
SYNC/MODE to GND
−0.3 V to +6.5 V
VOUT5, FB5 to GND
−0.3 V to +6.5 V
RT to GND
−0.3 V to +3.6 V
nINT, PWRGD to GND
−0.3 V to +6.5 V
FB1, FB2, FB3, FB4 to GND1
−0.3 V to +3.6 V
FB2 to GND2
−0.3 V to +6.5 V
FB4 to GND2
−0.3 V to +7 V
COMP1, COMP2, COMP3, COMP4
to GND
−0.3 V to +3.6 V
VDD, VDDIO to GND
−0.3 V to +3.6 V
SCL, SDA
−0.3 V to VDDIO + 0.3 V
Storage Temperate Range
−65°C to +150°C
Operational Junction Temperature
Range
−40°C to +125°C
1
This rating applies to the adjustable output voltage models of the ADP5050.
2
This rating applies to the fixed output voltage models of the ADP5050.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
48-Lead LFCSP
27.87
2.99
°C/W
ESD CAUTION



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