AD9739-R2-EBZ datasheet(8/48 Pages) AD

8 / 48 page

AD9739

Data Sheet

Rev. B | Page 8 of 48

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

With

Respect To

Rating

VDDA

VSSA

−0.3 V to +3.6 V

VDD33

VSS

−0.3 V to +3.6 V

VDD

VSS

−0.3 V to +1.98 V

VDDC

VSSC

−0.3 V to +1.98 V

VSSA

VSS

−0.3 V to +0.3 V

VSSA

VSSC

−0.3 V to +0.3 V

VSS

VSSC

−0.3 V to +0.3 V

DACCLK_P, DACCLK_N

VSSC

−0.3 V to VDDC + 0.18 V

DCI, DCO, SYNC_IN,

SYNC_OUT

VSS

−0.3 V to VDD33 + 0.3 V

LVDS Data Inputs

VSS

−0.3 V to VDD33 + 0.3 V

IOUTP, IOUTN

VSSA

−1.0 V to VDDA + 0.3 V

I120, VREF

VSSA

−0.3 V to VDDA + 0.3 V

IRQ, CS, SCLK, SDO,

SDIO, RESET

VSS

−0.3 V to VDD33 + 0.3 V

Junction Temperature

150°C

Storage Temperature

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

160-Ball CSP_BGA

31.2

7.0

°C/W1

1 With no airflow movement.

ESD CAUTION

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