Table of Contents

General Description ......................................................................................................................................................................................... 1

Applications ...................................................................................................................................................................................................... 1

Block Diagram .................................................................................................................................................................................................. 1

Main Features .................................................................................................................................................................................................. 2

Measurement Modes ....................................................................................................................................................................................... 2

1. Electrical, optical and timing characteristics ........................................................................................................................................... 5

1.1. Operating conditions and electrical characteristics ............................................................................................................................. 5

1.2. Absolute maximum ratings .................................................................................................................................................................. 6

1.3. Temperature sensor characteristics .................................................................................................................................................... 6

1.4. Timing parameters ............................................................................................................................................................................... 6

1.5. Optical characteristics .......................................................................................................................................................................... 7

1.6. TOF and grayscale sensitivity ............................................................................................................................................................. 7

1.7. Ambient-light / background-light (BG) suppression ............................................................................................................................. 7

2. Pin-out ..................................................................................................................................................................................................... 9

2.1. Pin mapping ......................................................................................................................................................................................... 9

2.2. Pin list ................................................................................................................................................................................................ 10

2.3. Power domain separation and ESD protection ................................................................................................................................. 12

3. Packaging and layout information ........................................................................................................................................................ 13

3.1. Mechanical dimensions .................................................................................................................................................................... 13

3.2. Pin1 marking ...................................................................................................................................................................................... 14

3.3. Location of the photosensitive area ................................................................................................................................................... 14

3.4. PCB design and SMD manufacturing process considerations ......................................................................................................... 15

3.5. Soldering and IC handling ................................................................................................................................................................. 15

4. Ordering Information ............................................................................................................................................................................. 16

5. Functional Description .......................................................................................................................................................................... 17

5.1. Typical Application Diagram .............................................................................................................................................................. 18

5.2. External Clock .................................................................................................................................................................................... 21

5.3. Supply, Reset and Start-up Options .................................................................................................................................................. 22

5.3.1. Supply voltages and external reset ................................................................................................................................................ 22

5.3.2. Software reset via I2C .................................................................................................................................................................... 23

5.3.3. Strap pins ........................................................................................................................................................................................ 23

5.3.4. Start-up (Clock, PLL turn-on and EEPROM copy) ......................................................................................................................... 23

5.4. I2C Slave ........................................................................................................................................................................................... 24

5.4.1. Device addressing .......................................................................................................................................................................... 24

5.4.2. I2C bus protocol notation ................................................................................................................................................................ 24

5.4.3. I2C bus timing ................................................................................................................................................................................. 25

5.4.4. General calls ................................................................................................................................................................................... 26

5.4.5. Write access ................................................................................................................................................................................... 26

5.4.6. Read access ................................................................................................................................................................................... 26

5.4.7. Control commands .......................................................................................................................................................................... 27

5.4.8. I2C control command examples: .................................................................................................................................................... 28

5.5. LED driver .......................................................................................................................................................................................... 30

5.6. DLL (Delay Locked Loop) .................................................................................................................................................................. 30

5.6.1. DLL locking operation ..................................................................................................................................................................... 31

5.6.2. DLL filters ........................................................................................................................................................................................ 32

5.7. Pixel-field ........................................................................................................................................................................................... 32

5.7.1. Pixel coordinates ............................................................................................................................................................................ 32

5.7.2. Pixel architecture ............................................................................................................................................................................ 32

Single MGX mode (default) ..................................................................................................................................................................... 33

Dual MGX mode with phase-shifted integration time (motion blur reduction) ......................................................................................... 34

Dual MGX mode with different integration times (High dynamic range) ................................................................................................. 34

ADC conversion speed-up ....................................................................................................................................................................... 35

Skipping sign bit in grayscale mode ........................................................................................................................................................ 35

5.7.3. Pixel saturation detection ............................................................................................................................................................... 36

5.7.4. Ambient-light suppression .............................................................................................................................................................. 36

5.8. Temperature sensor .......................................................................................................................................................................... 36

5.9. TOF camera interface (TCMI) ........................................................................................................................................................... 37

5.9.1. TCMI clock mode ............................................................................................................................................................................ 37

Continuous clock mode ........................................................................................................................................................................... 38

Gated clock mode .................................................................................................................................................................................... 38

5.9.2. Single or continuous measurement control .................................................................................................................................... 39

Single measurement control .................................................................................................................................................................... 39

Continuous measurement control (auto-run) ........................................................................................................................................... 39

5.9.3. TCMI data format ............................................................................................................................................................................ 39

5.9.4. TCMI embedded synchronization mode ......................................................................................................................................... 41

5.9.5. Detailed TCMI timing ...................................................................................................................................................................... 43

5.9.6. Frame rates and data-out performance .......................................................................................................................................... 45

Default Frame and 3D TOF 4x DCS distance measurement .................................................................................................................. 45

5.9.7. Example applications of CPU architectures for high-speed frame data transfer ........................................................................... 46

5.10. Power consumption levels ............................................................................................................................................................... 48

6. Measurement Modes ............................................................................................................................................................................ 49

6.1. Distance measurement modes (3D TOF) ......................................................................................................................................... 49

6.1.1. Modulator ........................................................................................................................................................................................ 49

6.1.2. Sine mode (sinusoidal modulation) ................................................................................................................................................ 49

Sine mode: Distance calculation algorithm ............................................................................................................................................. 50

Sine mode: Quality of the measurement result ....................................................................................................................................... 51

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Characteristics subject to change without notice

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