AD9656EBZ datasheet(46/47 Pages) AD

46 / 47 page

Data Sheet

AD9656

Rev. A | Page 45 of 46

OUTLINE DIMENSIONS

0.50

BSC

PIN 1

INDICATOR

PIN 1

INDICATOR

*6.70

6.60 SQ

6.50

0.45

0.40

0.35

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

0.30

0.25

0.18

8.10

8.00 SQ

7.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.20 MIN

6.50 REF

*COMPLIANT TO JEDEC STANDARDS MO-220-WLLD-5

WITH EXCEPTION TO EXPOSED PAD DIMENSION.

TOP VIEW

BOTTOM VIEW

EXPOSED

PAD

Figure 75. 56-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

8 mm × 8 mm Body, Very Very Thin Quad

(CP-56-9)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD9656BCPZ-125

−40°C to +85°C

56-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-56-9

AD9656BCPZRL7-125

−40°C to +85°C

56-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-56-9

AD9656EBZ

−40°C to +85°C

Evaluation Board

Z = RoHS Compliant Part.

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