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RA4M1 数据表(PDF) 53 Page - Renesas Technology Corp |
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RA4M1 数据表(HTML) 53 Page - Renesas Technology Corp |
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53 / 130 page ![]() R01DS0355EJ0100 Rev.1.00 Page 53 of 130 Oct 8, 2019 RA4M1 Group 2. Electrical Characteristics Note 1. The reference power supply current is included in the power supply current value for D/A conversion. Note 2. Current consumed only by the USBFS. Note 3. Includes the current supplied from the pull-up resistor of the USB_DP pin to the pull-down resistor of the host device, in addition to the current consumed by the MCU during the suspended state. Note 4. When VCC = VCC_USB = 3.3 V. Note 5. Current flowing only to the LCD controller. Not including the current that flows through the LCD panel. Note 6. When the MCU is in Software Standby mode or the MSTPCRD.MSTPD16 (ADC140 module stop bit) is in the module-stop state. Table 2.14 Operating and standby current (4) Conditions: VCC = AVCC0 = 1.6 to 5.5 V, VREFH0 = 2.7 V to AVCC0 Parameter Symbol Min Typ Max Unit Test conditions Analog power supply current During A/D conversion (at high-speed conversion) IAVCC -- 3.0 mA - During A/D conversion (at low-power conversion) - - 1.0 mA - During D/A conversion (per channel)*1 -0.4 0.8 mA - Waiting for A/D and D/A conversion (all units)*6 -- 1.0 μA - Reference power supply current During A/D conversion IREFH0 -- 150 μA - Waiting for A/D conversion (all units) - - 60 nA - During D/A conversion IREFH -50 100 μA - Waiting for D/A conversion (all units) - - 100 μA - Temperature sensor ITNS -75 - μA - Low-Power Analog Comparator operating current Window mode ICMPLP -15 - μA - Comparator High-speed mode - 10 - μA - Comparator Low-speed mode - 2 - μA - Comparator Low-speed mode using DAC8 - 820 - μA - Operational Amplifier operating current Low power mode 1 unit operating IAMP -2.5 4.0 μA - 2 units operating - 4.5 8.0 μA - 3 units operating - 6.5 11.0 μA - 4 units operating - 8.5 14.0 μA - High-speed mode 1 unit operating - 140 220 μA - 2 units operating - 280 410 μA - 3 units operating - 420 600 μA - 4 units operating - 560 780 μA - LCD operating current External resistance division method fLCD = fSUB = 128 Hz, 1/3 bias, and 4-time slice ILCD1*5 -0.34 - μA - Internal voltage boosting method (VLCD.VLCD = 04) fLCD = fSUB = 128 Hz, 1/3 bias, and 4-time slice ILCD2*5 -0.92 - μA - Capacitor split method fLCD = fSUB = 128 Hz, 1/3 bias, and 4-time slice ILCD3*5 -0.19 - μA - USB operating current During USB communication operation under the following settings and conditions: Host controller operation is set to full-speed mode Bulk OUT transfer (64 bytes) × 1, bulk IN transfer (64 bytes) × 1 Connect peripheral devices via a 1-meter USB cable from the USB port. IUSBH*2 - 4.3 (VCC) 0.9 (VCC_USB)*4 -mA - During USB communication operation under the following settings and conditions: Device controller operation is set to full-speed mode Bulk OUT transfer (64 bytes) × 1, bulk IN transfer (64 bytes) × 1 Connect the host device via a 1-meter USB cable from the USB port. IUSBF*2 - 3.6 (VCC) 1.1 (VCC_USB)*4 -mA - During suspended state under the following setting and conditions: Device controller operation is set to full-speed mode (pull up the USB_DP pin) Software standby mode Connect the host device via a 1-meter USB cable from the USB port. ISUSP*3 - 0.35 (VCC) 170 (VCC_USB)*4 -μA - |
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