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RA4M1 数据表(PDF) 53 Page - Renesas Technology Corp

部件名 RA4M1
功能描述  High efficiency 48-MHz Arm Cortex-M4 core, 256-KB code flash memory
PDF  130 Pages
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制造商  RENESAS [Renesas Technology Corp]
网页  http://www.renesas.com
标志 RENESAS - Renesas Technology Corp

RA4M1 数据表(HTML) 53 Page - Renesas Technology Corp

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R01DS0355EJ0100 Rev.1.00
Page 53 of 130
Oct 8, 2019
RA4M1 Group
2. Electrical Characteristics
Note 1.
The reference power supply current is included in the power supply current value for D/A conversion.
Note 2.
Current consumed only by the USBFS.
Note 3.
Includes the current supplied from the pull-up resistor of the USB_DP pin to the pull-down resistor of the host device, in addition
to the current consumed by the MCU during the suspended state.
Note 4.
When VCC = VCC_USB = 3.3 V.
Note 5.
Current flowing only to the LCD controller. Not including the current that flows through the LCD panel.
Note 6.
When the MCU is in Software Standby mode or the MSTPCRD.MSTPD16 (ADC140 module stop bit) is in the module-stop
state.
Table 2.14
Operating and standby current (4)
Conditions: VCC = AVCC0 = 1.6 to 5.5 V, VREFH0 = 2.7 V to AVCC0
Parameter
Symbol Min
Typ
Max
Unit
Test
conditions
Analog power
supply current
During A/D conversion (at high-speed conversion)
IAVCC
--
3.0
mA
-
During A/D conversion (at low-power conversion)
-
-
1.0
mA
-
During D/A conversion (per channel)*1
-0.4
0.8
mA
-
Waiting for A/D and D/A conversion (all units)*6
--
1.0
μA
-
Reference
power supply
current
During A/D conversion
IREFH0
--
150
μA
-
Waiting for A/D conversion (all units)
-
-
60
nA
-
During D/A conversion
IREFH
-50
100
μA
-
Waiting for D/A conversion (all units)
-
-
100
μA
-
Temperature sensor
ITNS
-75
-
μA
-
Low-Power
Analog
Comparator
operating
current
Window mode
ICMPLP
-15
-
μA
-
Comparator High-speed mode
-
10
-
μA
-
Comparator Low-speed mode
-
2
-
μA
-
Comparator Low-speed mode using DAC8
-
820
-
μA
-
Operational
Amplifier
operating
current
Low power mode
1 unit operating
IAMP
-2.5
4.0
μA
-
2 units operating
-
4.5
8.0
μA
-
3 units operating
-
6.5
11.0
μA
-
4 units operating
-
8.5
14.0
μA
-
High-speed mode
1 unit operating
-
140
220
μA
-
2 units operating
-
280
410
μA
-
3 units operating
-
420
600
μA
-
4 units operating
-
560
780
μA
-
LCD operating
current
External resistance division method
fLCD = fSUB = 128 Hz, 1/3 bias, and 4-time slice
ILCD1*5
-0.34
-
μA
-
Internal voltage boosting method (VLCD.VLCD = 04)
fLCD = fSUB = 128 Hz, 1/3 bias, and 4-time slice
ILCD2*5
-0.92
-
μA
-
Capacitor split method
fLCD = fSUB = 128 Hz, 1/3 bias, and 4-time slice
ILCD3*5
-0.19
-
μA
-
USB operating
current
During USB communication operation under the
following settings and conditions:
 Host controller operation is set to full-speed mode
Bulk OUT transfer (64 bytes) × 1,
bulk IN transfer (64 bytes) × 1
 Connect peripheral devices via a 1-meter USB
cable from the USB port.
IUSBH*2
-
4.3 (VCC)
0.9 (VCC_USB)*4
-mA
-
During USB communication operation under the
following settings and conditions:
 Device controller operation is set to full-speed mode
Bulk OUT transfer (64 bytes) × 1,
bulk IN transfer (64 bytes) × 1
 Connect the host device via a 1-meter USB cable
from the USB port.
IUSBF*2
-
3.6 (VCC)
1.1 (VCC_USB)*4
-mA
-
During suspended state under the following setting
and conditions:
 Device controller operation is set to full-speed mode
(pull up the USB_DP pin)
 Software standby mode
 Connect the host device via a 1-meter USB cable
from the USB port.
ISUSP*3
-
0.35 (VCC)
170 (VCC_USB)*4
-μA
-



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