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ADV7342 数据表(PDF) 67 Page - Analog Devices |
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ADV7342 数据表(HTML) 67 Page - Analog Devices |
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67 / 88 page ![]() ADV7342/ADV7343 Rev. 0 | Page 67 of 88 Power Supply Decoupling It is recommended that each power supply pin be decoupled with 10 nF and 0.1 μF ceramic capacitors. The VAA, PVDD, VDD_IO, and both VDD pins should be individually decoupled to ground. The decoupling capacitors should be placed as close as possible to the ADV7342/ADV7343 with the capacitor leads kept as short as possible to minimize lead inductance. A 1 μF tantalum capacitor is recommended across the VAA supply in addition to the 10 nF and 0.1 μF ceramic capacitors. Power Supply Sequencing The ADV7342/ADV7343 are robust to all power supply sequencing combinations. Any particular sequence can be used. Digital Signal Interconnect The digital signal traces should be isolated as much as possible from the analog outputs and other analog circuitry. Digital signal traces should not overlay the VAA or PVDD power planes. Due to the high clock rates used, avoid long clock traces to the ADV7342/ADV7343 to minimize noise pickup. Any pull-up termination resistors for the digital inputs should be connected to the VDD power supply. Any unused digital inputs should be tied to ground. Analog Signal Interconnect DAC output traces should be treated as transmission lines with appropriate measures taken to ensure optimal performance (for example, impedance matched traces). The DAC output traces should be kept as short as possible. The termination resistors on the DAC output traces should be placed as close as possible to and on the same side of the PCB as the ADV7342/ADV7343. To avoid crosstalk between the DAC outputs, it is recom- mended that as much space as possible be left between the traces connected to the DAC output pins. Adding ground traces between the DAC output traces is also recommended. |
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