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MPC8540CPX667JC 数据表(PDF) 66 Page - Freescale Semiconductor, Inc |
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MPC8540CPX667JC 数据表(HTML) 66 Page - Freescale Semiconductor, Inc |
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66 / 104 page  MPC8540 Integrated Processor Hardware Specifications, Rev. 4 66 Freescale Semiconductor Package and Pin Listings 14 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. 14.1 Package Parameters for the MPC8540 FC-PBGA The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783 flip chip plastic ball grid array (FC-PBGA). Die size 12.2 mm × 9.5 mm Package outline 29 mm × 29 mm Interconnects 783 Pitch 1 mm Minimum module height 3.07 mm Maximum module height 3.75 mm Solder Balls 62 Sn/36 Pb/2 Ag Ball diameter (typical) 0.5 mm 14.2 Mechanical Dimensions of the MPC8540 FC-PBGA Figure 43 the mechanical dimensions and bottom surface nomenclature of the MPC8540, 783 FC-PBGA package. |
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