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MPC8540CPX667JC 数据表(PDF) 87 Page - Freescale Semiconductor, Inc |
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MPC8540CPX667JC 数据表(HTML) 87 Page - Freescale Semiconductor, Inc |
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87 / 104 page  MPC8540 Integrated Processor Hardware Specifications, Rev. 4 Freescale Semiconductor 87 Thermal The spring mounting should be designed to apply the force only directly above the die. By localizing the force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the package. Figure 49 and Figure 50 provide exploded views of the plastic fence, heat sink, and spring clip. Figure 49. Exploded Views (1) of a Heat Sink Attachment using a Plastic Force |
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