 |
数据搜索系统，热门电子元器件搜索 |
|
|
数据搜索系统，热门电子元器件搜索 |
|
PIC16F753 数据表(PDF) 184 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
PIC16F753 数据表(HTML) 184 Page - Microchip Technology |
|
|
184 / 230 page  PIC16F753/HV753 DS40001709C-page 184 2013-2015 Microchip Technology Inc. TABLE 22-7: THERMAL CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Param No. Sym. Characteristic Typ. Units Conditions TH01 JA Thermal Resistance Junction to Ambient 84.6 °C/W 8-pin PDIP package 149.5 °C/W 8-pin SOIC package 60 °C/W 8-pin DFN 3x3mm package TH02 JC Thermal Resistance Junction to Case 41.2 °C/W 8-pin PDIP package 39.9 °C/W 8-pin SOIC package 9 °C/W 8-pin DFN 3x3mm package TH03 TJMAX Maximum Junction Temperature 150 °C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/ JA(2) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient temperature; TJ = Junction Temperature |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Chinese ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
