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MPC8309CVMADFC 数据表(PDF) 25 Page - NXP Semiconductors |
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MPC8309CVMADFC 数据表(HTML) 25 Page - NXP Semiconductors |
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25 / 81 page ![]() MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 Freescale Semiconductor 25 Ethernet and MII Management The following figure shows the MII receive AC timing diagram. Figure 13. MII Receive AC Timing Diagram 8.2.2 RMII AC Timing Specifications This section describes the RMII transmit and receive AC timing specifications. 8.2.2.1 RMII Transmit AC Timing Specifications The following table provides the RMII transmit AC timing specifications. The following figure provides the AC test load. Figure 14. AC Test Load Table 22. RMII Transmit AC Timing Specifications At recommended operating conditions with OVDD of 3.3 V ± 300mV. Parameter/Condition Symbol1 Min Typical Max Unit REF_CLK clock tRMX —20— ns REF_CLK duty cycle tRMXH/tRMX 35 — 65 % REF_CLK to RMII data TXD[1:0], TX_EN delay tRMTKHDX 2 — 13 ns REF_CLK data clock rise VIL(min) to VIH(max) tRMXR 1.0 — 4.0 ns REF_CLK data clock fall VIH(max) to VIL(min) tRMXF 1.0 — 4.0 ns Note: 1. The symbols used for timing specifications follow the pattern of t(first three letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMTKHDX symbolizes RMII transmit timing (RMT) for the time tRMX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular functional. For example, the subscript of tRMX represents the RMII(RM) reference (X) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). RX_CLK RXD[3:0] tMRDXKH tMRX tMRXH tMRXR tMRXF RX_DV RX_ER tMRDVKH Valid Data Output Z0 = 50 OVDD/2 RL = 50 |
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