MPC8309CVMADFC datasheet(72/81 Pages) NXP

72 / 81 page

MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3

Freescale Semiconductor

Thermal

24 Thermal

This section describes the thermal specifications of the MPC8309.

24.1

Thermal Characteristics

The following table provides the package thermal characteristics for the 369, 19

 19 mm MAPBGA of

the MPC8309.

24.1.1

Thermal Management Information

For the following sections, PD =(VDD  IDD)+PI/O, where PI/O is the power dissipation of the I/O

drivers.

24.1.2

Estimation of Junction Temperature with Junction-to-Ambient

Thermal Resistance

An estimation of the chip junction temperature, TJ, can be obtained from the equation:

TJ =TA +(R

JA  PD)

Eqn. 1

where:

TJ = junction temperature (C)

Table 64. Package Thermal Characteristics for MAPBGA

Characteristic

Board type

Symbol

Value

Unit

Notes

Junction-to-ambient natural convection

Single-layer board (1s)

RJA

°C/W

1, 2

Junction-to-ambient natural convection

Four-layer board (2s2p)

RJA

°C/W

1, 2, 3

Junction-to-ambient (@200 ft/min)

Single-layer board (1s)

RJMA

°C/W

1, 3

Junction-to-ambient (@200 ft/min)

Four-layer board (2s2p)

RJMA

°C/W

1, 3

Junction-to-board

—

RJB

°C/W

Junction-to-case

—

RJC

9°C/W

Junction-to-package top

Natural convection

JT

2°C/W

Notes:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

MPC8309CVMADFC 数据表(PDF) 72 Page - NXP Semiconductors

MPC8309CVMADFC 数据表(HTML) 72 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81

数据表下载

链接网址

MPC8309CVMADFC 数据表(PDF) 72 Page - NXP Semiconductors

MPC8309CVMADFC 数据表(HTML) 72 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81

数据表 下载

链接网址

数据表下载