MPC8309CVMADFC datasheet(11/81 Pages) NXP

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MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3

Freescale Semiconductor

Power Characteristics

Figure 3.

MPC8309 Power-Up Sequencing Example

Power Characteristics

The typical power dissipation for this family of MPC8309 devices is shown in the following table.

Table 5.

MPC8309 Power Dissipation

Core

Frequency (MHz)

QUICC Engine

Frequency (MHz)

CSB

Frequency (MHz)

Typical

Maximum

Unit

Note

266

233

133

0.341

0.920

1, 2, 3

333

233

133

0.361

0.938

1, 2, 3

400

233

133

0.381

0.969

1,2,3

417

233

167

0.429

1.003

1,2,3

Notes:

1. The values do not include I/O supply power (OVDD and GVDD), but it does include VDD and AVDD power. For I/O power

values, see Table 6.

2. Typical power is based on a nominal voltage of VDD = 1.0 V, ambient temperature, and the core running a Dhrystone

benchmark application. The measurements were taken on the evaluation board using WC process silicon.

3. Maximum power is based on a voltage of VDD = 1.05 V, WC process, a junction TJ = 105C, and a smoke test code.

90%

Core Voltage (VDD)

I/O Voltage (GVDD and OVDD)

0.7 V

PORESET

>= 32

 tSYS_CLK_IN / PCI_SYNC_IN

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