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Thermal Specifications and Design Considerations

Datasheet

5.1.2

Thermal Diode Offset

In order to improve the accuracy of diode based temperature measurements, a

temperature offset value (specified as Toffset) will be programmed into a Intel Core

Duo and Intel Core Solo processors’ MSR, which will contain thermal diode

characterization data. During manufacturing each processors thermal diode will be

evaluated for its behavior relative to a theoretical diode. Using the equation above, the

temperature error created by the difference between ntrim and the actual ideality of the

particular processor will be calculated.

If the ntrim value used to calculate Toffset differs from the ntrim value used in a

temperature sensing device, the Terror(nf) may not be accurate. If desired, the Toffset

can be adjusted by calculating nactual and then recalculating the offset using the actual

ntrim as defined in the temperature sensor manufacturers' datasheet.

The ntrim used to calculate the Diode Correction Toffset are listed in Table 21.

Contact your Intel representative for more details on the temperature offset MSR

definition and recommended offset implementation.

5.1.3

Intel® Thermal Monitor

The Intel Thermal Monitor helps control the processor temperature by activating the

TCC (Thermal Control Circuit) when the processor silicon reaches its maximum

operating temperature. The temperature at which the Intel Thermal Monitor activates

the TCC is not user configurable. Bus traffic is snooped in the normal manner, and

interrupt requests are latched (and serviced during the time that the clocks are on)

while the TCC is active.

With a properly designed and characterized thermal solution, it is anticipated that the

TCC would only be activated for very short periods of time when running the most

power intensive applications. The processor performance impact due to these brief

periods of TCC activation is expected to be minor and hence not detectable. An under-

designed thermal solution that is not able to prevent excessive activation of the TCC in

the anticipated ambient environment may cause a noticeable performance loss, and

may affect the long-term reliability of the processor. In addition, a thermal solution that

is significantly under designed may not be capable of cooling the processor even when

the TCC is active continuously.

The Intel Thermal Monitor controls the processor temperature by modulating (starting

and stopping) the processor core clocks when the processor silicon reaches its

maximum operating temperature. The Intel Thermal Monitor uses this mode to activate

the TCC: Automatic mode and on-demand mode. If both modes are activated,

Automatic mode takes precedence.

Note:

The Intel Thermal Monitor automatic mode must be enabled through BIOS for the

processor to be operating within specifications.

This automatic mode is called Intel Thermal Monitor 1 (TM1). This mode is selected by

writing values to the Model Specific Registers (MSRs) of the processor. After Automatic

mode is enabled, the TCC will activate only when the internal die temperature reaches

the maximum allowed value for operation.

Table 21.

Thermal Diode ntrim and Diode Correction Toffset

Symbol

Parameter

Unit

ntrim

Diode ideality used to calculate Toffset

1.01

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