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Thermal Specifications and Design Considerations

Thermal Specifications and

Design Considerations

The Celeron M processor requires a thermal solution to maintain temperatures within

operating limits as set forth in Section 5.1. Any attempt to operate that processor

outside these operating limits may result in permanent damage to the processor and

potentially other components in the system. As processor technology changes, thermal

management becomes increasingly crucial when building computer systems.

Maintaining the proper thermal environment is key to reliable, long-term system

operation. A complete thermal solution includes both component and system level

thermal management features. Component level thermal solutions include active or

passive heatsinks or heat exchangers attached to the processor exposed die. The

solution should make firm contact to the die while maintaining processor mechanical

specifications such as pressure. A typical system level thermal solution may consist of a

processor fan ducted to a heat exchanger that is thermally coupled to the processor via

a heat pipe or direct die attachment. A secondary fan or air from the processor fan may

also be used to cool other platform components or to lower the internal ambient

temperature within the system.

To allow for the optimal operation and long-term reliability of Intel processor-based

systems, the system/processor thermal solution should be designed such that the

processor remains within the minimum and maximum junction temperature (Tj)

specifications at the corresponding thermal design power (TDP) value listed in Table 16

and Table 17. Thermal solutions not designed to provide this level of thermal capability

may affect the long-term reliability of the processor and system.

Contact your Intel representative for more details on processor and system level

cooling approaches.

The maximum junction temperature is defined by an activation of the processor Intel®

Thermal Monitor. Refer to Section 5.1.3 for more details. Analysis indicates that real

applications are unlikely to cause the processor to consume the theoretical maximum

power dissipation for sustained time periods. Intel recommends that complete thermal

solution designs target the TDP indicated in Table 16 and Table 17. The Intel Thermal

Monitor feature is designed to help protect the processor in the unlikely event that an

application exceeds the TDP recommendation for a sustained period of time. For more

details on the usage of this feature, refer to Section 5.1.3. In all cases the Intel

Thermal Monitor feature must be enabled for the processor to remain within

specification.

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