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430 数据表(PDF) 64 Page - Intel Corporation |
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430 数据表(HTML) 64 Page - Intel Corporation |
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64 / 71 page ![]() Thermal Specifications and Design Considerations 64 Datasheet NOTES: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power specifications are determined by characterization of the processor currents at higher temperatures and extrapolating the values for the temperature indicated. 3. As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic mode is used to indicate that the maximum TJ has been reached. Refer to Section 5.1 for more details. 4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. Table 16. Power Specifications for the Celeron M Processor Standard Voltage Symbol Processor Number Core Frequency & Voltage Thermal Design Power Unit Notes TDP 450 440 430 420 410 2.00 GHz & HFM VCC 1.86 GHz & HFM VCC 1.73 GHz & HFM VCC 1.60 GHz & HFM VCC 1.46 GHz & HFM VCC 27 27 27 27 27 W1, 4 Symbol Parameter Min Typ Max Unit PAH, PSGNT Auto Halt, Stop Grant Power 10.1 W At 50°C 2 PSLP Sleep Power at VCC 10.0 W At 50°C 2 PDSLP Deep Sleep Power at VCC 6.5 W At 35°C 2 TJ Junction Temperature 0 100 °C3, 4 |
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