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Datasheet

Package Mechanical Specifications and Pin Information

Package Mechanical

Specifications and Pin

Information

The Celeron M processor is available in 478-pin Micro-FCPGA and 479-ball Micro-FCBGA

packages. The package mechanical dimensions, keep-out zones, loading specifications,

and mass specifications are shown in Figure 5 through Figure 8. Table 12 shows a top-

view of package pinout with their functionalities.

Caution:

The Micro-FCBGA package incorporates land-side capacitors. Avoid contacting the

capacitors with other electrically conductive materials on the motherboard. Doing so

may short the capacitors, and possibly damage the device or render it inactive.

4.1

Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-

out zone requirements. A thermal and mechanical solution design must not intrude into

the required keep-out zones. The location and quantity of capacitors may change, but

will remain within the component keep-in.

4.2

Package Loading Specifications

Maximum package loading specifications are static compressive loading in the direction

normal to the processor. This maximum load limit should not be exceeded during

shipping conditions, standard use condition, or by thermal solution. In addition, there

are additional load limitations against transient bend, shock, and tensile loading, all of

which can be obtained by contacting your field support. Moreover, the processor

package substrate should not be used as a mechanical reference or load-bearing

surface for thermal and mechanical solution.

4.3

Processor Mass Specifications

The typical mass of the processor is given in Figure 5 and Figure 8. This mass includes

all the components that are included in the package.

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