430 datasheet(65/71 Pages) INTEL

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Datasheet

Thermal Specifications and Design Considerations

NOTES:

The TDP specification should be used to design the processor thermal solution. The TDP is

not the maximum theoretical power the processor can generate.

Not 100% tested. These power specifications are determined by characterization of the

processor currents at higher temperatures and extrapolating the values for the

temperature indicated.

As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal

Monitor’s automatic mode is used to indicate that the maximum TJ has been reached.

Refer to Section 5.1 for more details.

The Intel Thermal Monitor automatic mode must be enabled for the processor to operate

within specifications.

5.1

Thermal Specifications

The Celeron M processor incorporates three methods of monitoring die temperature,

the Digital thermal sensor, Intel Thermal Monitor and the thermal diode. The Intel

Thermal Monitor (detailed in Section 5.1.3) must be used to determine when the

maximum specified processor junction temperature has been reached.

5.1.1

Thermal Diode

The processor incorporates an on-die PNP transistor whose base emitter junction is

used as a thermal diode, with its collector shorted to Ground. The thermal diode, can

be read by an off-die analog/digital converter (a thermal sensor) located on the

motherboard, or a stand-alone measurement kit. The thermal diode may be used to

monitor the die temperature of the processor for thermal management or

instrumentation purposes but is not a reliable indication that the maximum operating

temperature of the processor has been reached. When using the thermal diode, a

temperature offset value must be read from a processor model specific register (MSR)

and applied. See Section 5.1.2 for more details. Please see Section 5.1.3 for thermal

diode usage recommendation when the PROCHOT# signal is not asserted.

Note:

The reading of the external thermal sensor (on the motherboard) connected to the

processor thermal diode signals, will not necessarily reflect the temperature of the

hottest location on the die. This is due to inaccuracies in the external thermal sensor,

Table 17.

Power Specifications for the Celeron M Processor Ultra Low Voltage

Symbol

Processor

Number

Core Frequency

& Voltage

Thermal Design

Power

Unit

Notes

TDP

443

423

1.20 GHz & HFM VCC

1.06 GHz & HFM VCC

5.5

1, 4

Symbol

Parameter

Min

Typ

Max

Unit

PAH,

PSGNT

Auto Halt, Stop Grant Power

3.0

50°C

PSLP

Sleep Power at VCC

2.9

50°C

PDSLP

Deep Sleep Power at VCC

1.5

35°C

Junction Temperature

100

°C3, 4

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